Abstract
Electronic waste poses a serious environmental threat due to the content of heavy metals. The aim of the work is to evaluate the leaching of heavy metals (Cu, Pb, Zn, Cd, Cr, Ni) from printed circuit boards and cables under simulated urban landfill conditions (SPLP method, 8 cycles). E-waste was found to be a significant source of contamination. Printed circuit boards showed a gradual increase in the concentrations of Cu (up to 2.33 mg/L), Pb (up to 0.666 mg/L) and Zn (up to 1.385 mg/L) in the leachate. The cables were characterized by high initial Cu removal (3.50 mg/L) followed by a decrease. A heuristic risk assessment model was developed.
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Publication Info
- Year
- 2025
- Type
- article
- Volume
- 33
- Issue
- 4
- Pages
- 467-476
- Citations
- 0
- Access
- Closed
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Cite This
Daniil A. Ostanniy,
M.A. Shakhramanyan
(2025).
Electronic waste as a source of heavy metal contamination of soils: leaching dynamics under simulated landfill conditions.
RUDN Journal of Ecology and Life Safety
, 33
(4)
, 467-476.
https://doi.org/10.22363/2313-2310-2025-33-4-467-476
Identifiers
- DOI
- 10.22363/2313-2310-2025-33-4-467-476