Abstract In this paper we investigate the properties of indentation hardness on the sub-micrometre scale in nickel, gold and silicon. Indenter penetration depths as low as 20 nm are used. The area of the indents is determined by electron microscopy, and thus the Meyer hardness calculated. The indenter penetration is monitored continuously during loading and unloading. We show that indent areas, and therefore hardness, may be determined from penetration depth with reasonable accuracy, and that elastic relaxation can be quantitatively understood. We discuss the marked increase of indentation hardness with decreasing indent size on the sub-micrometre scale. Small indents in silicon showed no evidence of cracking, but did show unusual deformation characteristics.
Abstract The mechanical properties of thin films can be measured by a variety of different techniques, with nanoindentation being one of the most recent developments in this gro...
Abstract A combined atomic force microscopy (AFM)-nanoindentation system was developed which has a silicon tip for imaging and a diamond indenter for indentation testing. The sy...
Abstract On the nanometre scale, the actual indenter-material contact area must be carefully determined to obtain reliable values of mechanical properties from an indentation te...
With a microhardness arrangement which is constructed as an accessory equipment for modern material testing machines the generation of Vickers indentation is investigated by rec...
Epoxy resins are suitable media for embedding for electron microscopy, as they set uniformly with virtually no shrinkage. A mixture of araldite epoxy resins has been developed w...
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