Hydrogen‐Bond Assembly Energetic Films with Ultra‐Flexibility and Reactivity for Advanced Transient Microchips

Abstract

Abstract Transient microchips have attracted considerable attention in the field of information security and privacy protection due to their self‐destruction capability. Metastable intermolecular composites (MICs) are appealing for such applications due to their high energy density and rapid reaction kinetics, which meet the demands for miniaturization and fast response in transient microchips. However, weak interfacial interactions in conventional MICs limit the contact between components, hindering both microchip integration and ignition reliability. Herein, a hydrogen‐bond assembly strategy is proposed to fabricate BC/GO/Al/CuO energetic films with exceptional flexibility and superior combustion performance. Dopamine modification introduces abundant hydroxyl groups onto the MIC particle surfaces, enabling the formation of a continuous hydrogen‐bond network with binder bacterial cellulose (BC) binder and functional additive graphene oxide (GO).The integrated transient microchips retain structural integrity after 25 drop tests from 50 cm height, and the BC/GO/Al/CuO films are reliably ignited using a 3 V/3 A power supply, inducing complete destruction to the silicon substrate. This work demonstrates a novel strategy for creating highly flexible and reactive energetic films, showing great promise for application in advanced transient microchips.

Affiliated Institutions

• Southwest University of Science and Technology CN
• Beijing Institute of Technology CN
• China Academy of Engineering Physics CN
• Nanjing University of Science and Technology CN

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