Thermal stability of submicron grained copper and nickel

Rinat K. Islamgaliev; František Chmelı́k; R. Kužel

doi:10.1016/s0921-5093(97)00107-x

Keywords

Materials scienceGrain boundaryThermal stabilityCopperTransmission electron microscopyGrain sizeNickelDifferential scanning calorimetryMetallurgyIndentation hardnessGrain growthRelaxation (psychology)Severe plastic deformationComposite materialCrystallographyMicrostructureThermodynamicsNanotechnologyChemistry

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Publication Info

Year: 1997
Type: article
Volume: 237
Issue: 1
Pages: 43-51
Citations: 106
Access: Closed

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APA Style

                            
                                    Rinat K. Islamgaliev, 
                                
                                    František Chmelı́k, 
                                
                                    R. Kužel
                                
                            (1997). 
                            Thermal stability of submicron grained copper and nickel. 
                            Materials Science and Engineering A
                            , 237
                            (1)
                            , 43-51.
                            https://doi.org/10.1016/s0921-5093(97)00107-x

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DOI: 10.1016/s0921-5093(97)00107-x

Data Quality

Data completeness: 68%